Demanding embedded computing applications require the ability to transmit data between electronic components at very high speeds, often averaging tens of gigabits per second or higher. To do so efficiently, an optical backplane interconnect would allow data to be transmitted at a significantly higher bandwidth and lower latency.

Bensheim, Germany –– TE Connectivity (TE) developed the PicoMQS miniaturized automotive connector system for compact signal interfaces deployed in high temperature and high vibration automotive applications.

Small but mighty high-voltage contactor proves ideal for low power consumption applications

The industrial automation and manufacturing sectors use an unfathomable number of interface types, communication protocols, and power delivery mediums simply to turn on and move data between machines. While each was optimized for a specific purpose, on a larger scale this differentiation turns from an advantage to an impediment.

TE Connectivity introduced a new generation of free height computer-on-module (COM) connectors in 0.5mm centerline to address vertical, parallel board-to-board connections that require high-speed data transmission and different stacking heights. These new connectors are compliant with the COM Express Type 7 specification and can be compatible with the PCIe Gen 4 protocol.

TE's SUPERSEAL pro connectors are lightweight and suitable for wire-to-wire and wire-to-device applications.

TE Connectivity announced it has added Extra Rugged Circular connectors (XRC), Sealed Rectangular Connectors (SRC), ML-XT connectors, and XRC terminals to its portfolio of connectivity solutions.